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Key Responsibilities and Required Skills for Ion Beam Technician

💰 $ - $

EngineeringManufacturingSemiconductorMaterials ScienceLaboratory

🎯 Role Definition

An Ion Beam Technician is a hands-on technical professional responsible for operating and maintaining ion beam systems (e.g., Focused Ion Beam (FIB), ion implanters, broad/beamline ion systems) to perform precision sample preparation, micro- and nano-fabrication, failure analysis, materials modification, and device prototyping. The role emphasizes safe operation of high-vacuum, high-voltage equipment, strict adherence to process control and cleanroom protocols, meticulous documentation, and collaboration with engineering, R&D and quality teams to deliver accurate, reproducible results used in semiconductor, MEMS, materials research, and failure analysis workflows.


📈 Career Progression

Typical Career Path

Entry Point From:

  • Laboratory Technician (Materials, Microfabrication, Failure Analysis)
  • Process Technician (Semiconductor, MEMS, R&D)
  • Manufacturing Technician (Cleanroom / Vacuum Systems)

Advancement To:

  • Senior Ion Beam Technician / Lead FIB Technician
  • FIB Process Engineer / Ion Beam Process Engineer
  • Failure Analysis Engineer / Materials Characterization Engineer
  • Applications Engineer (Ion Beam / Metrology Tools)
  • Lab Manager or Technical Team Lead

Lateral Moves:

  • SEM / TEM Technician
  • Metrology / Characterization Technician
  • Cleanroom Process Technician
  • Surface Analysis Specialist (XPS, SIMS)

Core Responsibilities

Primary Functions

  • Operate and optimize Focused Ion Beam (FIB) systems to perform high-precision cross-sectioning, trenching, lift-out and TEM sample preparation, ensuring consistent results that meet yield, quality, and turnaround targets.
  • Set up, calibrate and align ion sources, beam optics, stage motors, detectors and gas injection systems to maintain peak FIB performance and meet process specifications.
  • Execute ion implantation and ion beam modification processes with strict dose, energy and tilt control for device prototyping, doping trials, and materials engineering activities.
  • Perform ion milling and micromachining operations for microfabrication, including nanostructure patterning, circuit edit, and localized material removal while minimizing beam-induced damage.
  • Troubleshoot, diagnose and repair ion beam system subsystems (vacuum pumps, power supplies, beam alignment, ion sources) in coordination with vendor service engineers to minimize downtime.
  • Maintain and tune vacuum systems (turbo, backing pumps, cryo/pumps) and high-voltage supplies, including leak checking, pump oil changes and scheduled preventative maintenance.
  • Prepare and mount samples (cutting, polishing, conductive coating, mounting on TEM grids) using best practices to prevent contamination and ensure reliable imaging and analysis.
  • Operate complementary SEM imaging and analytical tools (EDS, EBSD, BSE/SE detectors) to document microstructure and composition during ion beam processes.
  • Support failure analysis processes by producing cross-sections, site-specific lift-outs and targeted milling for root-cause investigations of electronic, MEMS and material failures.
  • Implement and follow rigorous cleanroom protocols (ISO classes), contamination control, ESD protection, and sample handling procedures to protect sensitive devices and test structures.
  • Perform process characterization studies, write/maintain process recipes and parameter windows, and contribute to process control plans to reduce variability and improve throughput.
  • Collect, analyze and report process metrics (beam current stability, milling rates, implantation dose verification, yield correlation) and recommend corrective actions.
  • Operate gas injection and deposition systems for localized Pt/C deposition, ion-assisted deposition, and protective cap deposition for FIB lift-out and TEM preparation.
  • Provide hands-on training and mentorship for junior technicians and engineers on FIB workflows, safety procedures, and best practices for sample prep and analysis.
  • Manage spare parts, consumables (e.g., ion sources, apertures, gas canisters, sample mounts) and tool calibration schedules to ensure uninterrupted lab operations.
  • Coordinate with engineering, research scientists and QA teams to plan experiments, prioritize job queues and ensure alignment between lab capabilities and program timelines.
  • Maintain detailed, audit-ready process documentation and electronic lab notebooks (ELN), including imaging, beam parameters, tool logbooks and nonconformance reports.
  • Follow radiation, high-voltage and vacuum safety protocols, maintain safety training records, and participate in incident investigations and corrective action planning.
  • Conduct regular cleanliness and contamination audits, implement corrective actions for particle generation or cross-contamination, and ensure compliance with regulatory and customer standards.
  • Assist in tool evaluation, selection and qualification of new ion beam equipment and complementary metrology systems by running test matrices and reporting performance against specifications.
  • Lead continuous improvement initiatives to increase throughput, reduce rework, and lower cost-per-sample by optimizing milling recipes, automation sequences and sample handling workflows.
  • Support sample routing, packaging and shipment logistics for external characterization labs while ensuring preservation of delicate TEM lamellae and site-specific specimens.

Secondary Functions

  • Generate and maintain standardized process recipes and work instructions in the company’s quality management system.
  • Support method development projects, including DOE execution, to transfer processes from R&D to production or to qualify new materials and protocols.
  • Assist with setting up and maintaining sample databases, imaging libraries and metadata tagging to enable efficient retrieval and analysis of historical data.
  • Participate in cross-functional project meetings to provide technical input on manufacturability, tooling constraints and process risk.
  • Provide technical support to customers and internal stakeholders for application-specific sample prep, imaging strategies and interpretation of ion beam artifacts.
  • Support lab scheduling, job prioritization and utilization reporting to maximize tool uptime and meet project deadlines.
  • Contribute to intellectual property generation by documenting novel sample preparation techniques, FIB-based processes and experimental results.
  • Help plan and execute validation activities and acceptance testing for new or refurbished ion beam systems.
  • Participate in supplier qualification activities for critical consumables, replacement parts and third-party service providers.
  • Maintain training matrices and ensure team members remain current on required certifications and vendor tool training.

Required Skills & Competencies

Hard Skills (Technical)

  • Hands-on operation and optimization of Focused Ion Beam (FIB) systems (e.g., FEI/ ThermoFisher, Zeiss) for milling, imaging and TEM lamella preparation.
  • Experience with scanning electron microscopes (SEM) and combined FIB-SEM workflows, including imaging modes, detectors and parameter selection.
  • Practical knowledge of ion implanter equipment and implantation parameter control (dose, energy, tilt) for device and materials modification.
  • Proficiency with vacuum systems, leak detection, turbopump maintenance, and high-voltage safety associated with ion beam tools.
  • Familiarity with gas injection systems (GIS) for deposition and etch assist, and the ability to manage precursor handling safely.
  • Competence with sample preparation tools: dicing saws, polishing, sputter coaters, ultramicrotomes, and conductive coating procedures.
  • Ability to run and interpret analytical techniques commonly paired with FIB/SEM: EDS, EBSD, SIMS, AFM, TEM correlations.
  • Experience with process control, recipe development, design of experiments (DOE), and statistical process monitoring for beam-based processes.
  • Strong technical documentation skills, including electronic lab notebook (ELN) entries, process sheets, and tool logbooks.
  • Experience with cleanroom protocols (ISO classifications), ESD control, contamination prevention, and materials handling in controlled environments.
  • Basic familiarity with CAD/CAM for stage positioning, patterning and automated milling scripts.
  • Knowledge of safety regulations and radiation/high-voltage precautionary measures relevant to ion beam operation.
  • Competence in imaging analysis software and basic scripting or macros for automated image capture and measurement.
  • Ability to interpret engineering drawings, specifications and metrology requirements for device-level sample prep.

Soft Skills

  • Exceptional attention to detail and craftsmanship—precision sample prep and reproducible process execution are critical.
  • Strong problem-solving and troubleshooting ability to diagnose tool and process issues under time constraints.
  • Effective verbal and written communication for cross-functional collaboration and clear documentation of experimental results.
  • Time management and prioritization skills to balance multiple jobs and maintain SLAs for R&D and production stakeholders.
  • Collaborative team player who can mentor junior staff and work closely with engineers, scientists and QA personnel.
  • Adaptability and continuous learning mindset to adopt new tools, materials and techniques in micro/nano-fabrication.
  • Customer-focused orientation with ability to translate technical constraints into actionable recommendations for product teams.
  • Quality-conscious attitude and ability to adhere to regulatory, safety and audit requirements.
  • Initiative and ownership—drive improvements, preventive maintenance schedules and cost-saving initiatives.
  • Resilience under pressure; ability to manage a fast-paced laboratory environment with competing priorities.

Education & Experience

Educational Background

Minimum Education:

  • Associate degree or technical diploma in Materials Science, Applied Physics, Electrical/Electronic Engineering Technology, Semiconductor Manufacturing, or a closely related technical field.

Preferred Education:

  • Bachelor’s degree in Materials Science & Engineering, Physics, Electrical Engineering, Mechanical Engineering, or Nanotechnology.

Relevant Fields of Study:

  • Materials Science and Engineering
  • Applied Physics / Nanoscience
  • Electrical Engineering / Microelectronics
  • Mechanical Engineering / Manufacturing Technology
  • Semiconductor Process Technology

Experience Requirements

Typical Experience Range:

  • 1–5 years operating FIB/SEM or related ion beam equipment in R&D, failure analysis, or production environments. (Entry-level positions may accept 0–2 years with strong technical training.)

Preferred:

  • 3+ years of hands-on experience with Focused Ion Beam (FIB) systems and SEM imaging for TEM sample preparation, microfabrication, or failure analysis in semiconductor, MEMS, or materials research labs.
  • Demonstrated experience with cleanroom protocols, vacuum system maintenance, and process recipe development.
  • Prior vendor tool training and experience collaborating with OEM service engineers on preventive maintenance and repairs.

For hiring managers: include keywords such as "Focused Ion Beam", "FIB-SEM", "ion implantation", "TEM lamella", "vacuum systems", "failure analysis", "cleanroom", "process recipes", and "metrology" in your job posting to improve discoverability and alignment with candidate search intent.